The SurPass 3000 Cationic Photoresist Adhesion Promoter is our specialized solution for enhancing the bond between resists and difficult substrates like gold or noble metals. At DisChem, Inc., we utilize unique cationic chemistry to ensure a strong, uniform attachment that resists peeling even under harsh processing conditions. This product is a favorite in microfluidics and sensor manufacturing, where multi-layered structures require absolute stability. It provides a reliable, easy-to-use alternative to traditional, more hazardous adhesion promotion methods.

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Phone Number : +1(814)-7726-603

Email ID : [email protected]

Address : 17295 Boot Jack Rd, Suite A PO Box 267 Ridgway, Pennsylvania 15853 USA